中国空间科学技术

›› 2011, Vol. 31 ›› Issue (3): 71-75.doi: 10.3780/j.issn.1000-758X.2011.03.011

• 技术交流 • 上一篇    下一篇

功率组件基于等离子清洗的免钎剂真空软钎焊技术

 陈雅容, 胡凤达, 高伟娜, 杨猛   

  1. （中国空间技术研究院， 北京 100190）
  • 收稿日期:2010-12-20 修回日期:2011-03-22 出版日期:2011-06-25 发布日期:2011-06-25
  • 作者简介:陈雅容 1981年生，2006年获哈尔滨工业大学材料学院电子封装专业硕士学位，工程师。研究方向为星船电子产品装联工艺及可靠性技术。

New Fluxless Vacuum Soldering Process Using Plasma Cleaning in Power Modules

CHEN  Ya-Rong, HU  Feng-Da, GAO  Wei-Na, YANG  Meng   

  1. (China Academy of Space Technology，Beijing 100190)
  • Received:2010-12-20 Revised:2011-03-22 Published:2011-06-25 Online:2011-06-25

PDF (PC)

1848

被引次数

1

摘要： 为解决功率电子产品中陶瓷电路板与热沉载体功率组件焊接效率低、空洞率高等问题，对焊接过程中的焊料类型，真空度以及空洞率进行了研究，提出了一种新的免钎剂真空焊接方法。研究结果表明，使用等离子清洗的焊片可显著提高抽真空速率，并减少气泡，降低空洞率；采用新焊接方法得到的试样空洞率低、焊接效率高、质量一致性好，可用于高可靠性功率电子产品中。

关键词: 等离子清洗, 免钎剂, 空洞率, 真空焊接, 焊片

Abstract: In order to resolve the problems of low soldering efficiency and high void ratio in power modules, the solder type, vacuity and void ratio were investigated, and a new fluxless vacuum soldering process using plasma cleaning was presented. The results show that the vacuum pumping rate is increased and the void ratio is decreased obviously using solder sheet and plasma cleaning technology. The new soldering process with low void ratio, high efficiency and high quality conformance can be used in the soldering of high reliability power electronics.

Key words: Plasma cleaning, Fluxless, Void ratio, Vacuum soldering, Solder sheet