中国空间科学技术

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固体界面间接触热阻的理论分析

赵兰萍,徐烈   

  1. 同济大学,上海交通大学制冷工程研究所 上海200092 ,上海200030
  • 发布日期:2003-08-25

Theoretical Analysis of Thermal Contact Resistance Between Solid Interfaces

Zhao Lanping (Tongji University, Shanghai 200092) Xu Lie (Department of Refrigeration and Cryogenics, Shanghai Jiao Tong University, Shanghai 200030)$$$$   

  • Published:2003-08-25

摘要： 在M T接触导热分形模型的基础上 ,考虑了各接触点的收缩热阻 ,对M T模型进行了修正。在此基础上 ,分析了表面分形参数、界面温度及材料物性等因素与接触热导的关系 ,并结合实验数据对修正型M T接触导热模型、经典Mikic模型和Yovanovich模型的预测结果进行了对比分析

关键词: 接触热阻, 模型, 分析, 航天器

Abstract: A new fractional thermal contact conductance (TCC) model based on fractional geometry , the M T model and classical thermal contact theory which includies bulk resistance and also constriction resistance is developed. The relation between TCC values and the affecting factors such as the contact pressure, the fractal roughness, the material properties and the interface temperature is derived from this model.