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Theoretical Analysis of Thermal Contact Resistance Between Solid Interfaces

Zhao Lanping (Tongji University, Shanghai 200092) Xu Lie (Department of Refrigeration and Cryogenics, Shanghai Jiao Tong University, Shanghai 200030)$$$$   

  • Published:2003-08-25

Abstract: A new fractional thermal contact conductance (TCC) model based on fractional geometry , the M T model and classical thermal contact theory which includies bulk resistance and also constriction resistance is developed. The relation between TCC values and the affecting factors such as the contact pressure, the fractal roughness, the material properties and the interface temperature is derived from this model.