中国空间科学技术

中国空间科学技术 ›› 2025, Vol. 45 ›› Issue (3): 67-76.doi: 10.16708/j.cnki.1000.758X.2025.0039

• 综述 • 上一篇    下一篇

器官芯片在太空应用的工程难点和解决方案分析

尉雅明1，邹建锋1，*，黄小桃2   

  1. 1.浙江大学 航空航天学院，杭州310027
    2.广东顺德工业设计研究院（广东顺德创新研究院），佛山528000
  • 收稿日期:2023-12-04 修回日期:2024-04-28 录用日期:2024-05-10 发布日期:2025-05-15 出版日期:2025-06-01

Analysis of engineering challenges and solutions for organ-on-a-chip applications in space

WEI Yaming1， ZOU Jianfeng1,*， HUANG Xiaotao2   

  1. 1.School of Aeronautics and Astronautics， Zhejiang University， Hangzhou 310027， China
    2.Guangdong Shunde Industry Design Institute (Guangdong Shunde Innovative Design Institute)， Foshan 528000， China
  • Received:2023-12-04 Revision received:2024-04-28 Accepted:2024-05-10 Online:2025-05-15 Published:2025-06-01

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摘要： 针对器官芯片在太空应用中面临的工程难点进行了系统分析，并提出相应的解决方案。首先，综述了器官芯片技术的发展及其在太空环境中的应用前景。其次，从微重力、辐射、温度波动等方面探讨了太空环境对器官芯片的影响，并分析了器官芯片在太空应用中的功能复杂性、能耗与尺寸限制、长期稳定性、标准化与验证等难点。最后，提出了包括表面涂层和功能化修饰、微环境调控、自动化监测与控制在内的解决方案，为器官芯片在太空环境下的应用提供了工程参考。

关键词: 器官芯片, 太空应用, 航天医学, 航天器

Abstract: This study systematically analyzes the engineering challenges associated with the application of organ chips in space and proposes corresponding solutions. It begins by reviewing the development of organ chip technology and its potential applications in space. The paper then examines the effects of the space environment, such as microgravity, radiation, and temperature fluctuations, on organ chips. The difficulties related to functional complexity, power consumption, size limitations, long-term stability, the need for standardization and validation are analyzed. Concluding the analysis, the study offers solutions that encompass surface coating and functional modifications, microenvironment control, automated monitoring and control systems, thereby providing an engineering framework for the deployment of organ chips in space.

Key words: organ-on-a-chip, space application, aerospace medicine, spacecraft